Storage chip prices remain at high levels, with some differentiation across the market, The Paper learned from memory-industry agents and distributors. DRAM and SSDs for the enterprise market are still rising. Consumer-grade storage is also rising, but prices are described as negotiable.
A staff member at a leading memory-chip agent told The Paper that increases are certain because AI computing centers have large storage demand. Higher consumer prices, however, have made finished products harder to sell, leaving the market in a state where “prices are negotiable.”
The person said leading original manufacturers are unwilling to cut prices. Companies such as SK hynix and Samsung already hold large long-term contracts tied to AI demand and do not want to discount consumer-grade products; unsold consumer supply can be redirected to AI demand. The secondary market is changing quickly, the person added, and even operators may not be able to control prices well.
A distributor confirmed to The Paper that storage prices on the secondary market are still rising.
Based on earlier information from major upstream manufacturers, storage prices are expected to rise further by the end of this year or early next year.
In October, South Korean media reported that as high-bandwidth memory moves from fifth-generation HBM3E to sixth-generation HBM4, Samsung Electronics is planning to raise 2027 supply prices to more than double current levels, an increase of more than 100%.
Also in October, Taiwanese memory maker Nanya Technology notified customers of another increase in DRAM contract prices, with the largest rise reaching 20%. Asked about the reports, Nanya said it would not comment on matters related to customer quotations.
On October 22, Goke Microelectronics issued a price-adjustment notice to customers and distributors, announcing a further increase for packaged KGD (Known Good Die) storage products from November 2026. It is the company’s second price rise this year and the first time it has quoted in absolute U.S. dollar amounts rather than by percentage.
The agent said consumer-device makers face heavy pressure from higher storage prices, and many companies have begun using “recycled material”—used chips removed from old devices. The overall share is still not high, but it may grow.
A TrendForce report shows reballed memory recovered from dismantled devices accounting for 3% to 4% of the smartphone market in 2026, possibly rising to 7% to 9% in 2027. Recycled 4GB LPDDR4X chips are mostly used in 4G phones priced below 1,299 yuan. In price-sensitive low-end markets, the approach can ease higher material costs and help manufacturers keep selling prices competitive.
Recycled chips also carry quality risks. The source, prior use, and refurbishment of old memory can make consistent quality harder to ensure, affecting reliability and lifespan and raising repair and warranty costs. Manufacturers need to weigh short-term savings against longer-term product quality and after-sales expense.
On PC DRAM supply, TrendForce said that with AI application demand remaining steady, original manufacturers have made preliminary plans to reduce PC DRAM supply in 2027. Related capacity faces relatively little pressure to be absorbed, and manufacturers still need strategic cooperation with customers while positioning for edge AI, leaving some flexibility to slightly moderate price increases. TrendForce estimates that PC DRAM contract prices will rise 13% to 18% quarter on quarter in the fourth quarter of 2026, a smaller gain than in the previous quarter.
Original article: https://m.thepaper.cn/newsDetail_forward_34453174
